Inside 6th gen Intel® Core™: New microarchitecture code named skylake

Ittai Anati; David Blythe; Jack Doweck; Hong Jiang; Wen Fu Kao; Julius Mandelblat; Lihu Rappoport; Efraim Rotem; Ahmad Yasin

doi:10.1109/HOTCHIPS.2016.7936222

Inside 6th gen Intel^® Core™: New microarchitecture code named skylake

Ittai Anati, David Blythe, Jack Doweck, Hong Jiang, Wen Fu Kao, Julius Mandelblat, Lihu Rappoport, Efraim Rotem, Ahmad Yasin

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

•Skylake delivers record levels of performance and battery life in many personal computing use cases and form factors •Intel^® Speed Shift Technology provides higher performance, responsiveness and efficiency at power constrained form factors •Skylake Processor Graphics delivers scalable performance, >1TFLOPS compute, enhanced low power media engines, flexible power management, and end-to-end 4K experience •Skylake family of products allows developers to: •Choose from wide range of platform capabilities •Innovate with products for wide range of thermal envelopes and I/O solutions •Optimize the system performance using the advanced PMU capabilities •Skylake introduces Intel^® SGX: a revolutionary game changer to trusted application security in the main stream SW environment.

Original language	English
Title of host publication	2016 IEEE Hot Chips 28 Symposium, HCS 2016
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781509062089
DOIs	https://doi.org/10.1109/HOTCHIPS.2016.7936222
State	Published - 30 May 2017
Externally published	Yes
Event	28th IEEE Hot Chips Symposium, HCS 2016 - Cupertino, United States Duration: 21 Aug 2016 → 23 Aug 2016

Publication series

Name	2016 IEEE Hot Chips 28 Symposium, HCS 2016

Conference

Conference	28th IEEE Hot Chips Symposium, HCS 2016
Country/Territory	United States
City	Cupertino
Period	21/08/16 → 23/08/16

Bibliographical note

Publisher Copyright:
© 2016 IEEE.

ASJC Scopus subject areas

Hardware and Architecture

Access to Document

10.1109/HOTCHIPS.2016.7936222

Cite this

Anati, I., Blythe, D., Doweck, J., Jiang, H., Kao, W. F., Mandelblat, J., Rappoport, L., Rotem, E., & Yasin, A. (2017). Inside 6th gen Intel^® Core™: New microarchitecture code named skylake. In 2016 IEEE Hot Chips 28 Symposium, HCS 2016 Article 7936222 (2016 IEEE Hot Chips 28 Symposium, HCS 2016). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/HOTCHIPS.2016.7936222

@inproceedings{24ae3344759443939562add8e5557a54,

title = "Inside 6th gen Intel{\textregistered} Core{\texttrademark}: New microarchitecture code named skylake",

abstract = "•Skylake delivers record levels of performance and battery life in many personal computing use cases and form factors •Intel{\textregistered} Speed Shift Technology provides higher performance, responsiveness and efficiency at power constrained form factors •Skylake Processor Graphics delivers scalable performance, >1TFLOPS compute, enhanced low power media engines, flexible power management, and end-to-end 4K experience •Skylake family of products allows developers to: •Choose from wide range of platform capabilities •Innovate with products for wide range of thermal envelopes and I/O solutions •Optimize the system performance using the advanced PMU capabilities •Skylake introduces Intel{\textregistered} SGX: a revolutionary game changer to trusted application security in the main stream SW environment.",

author = "Ittai Anati and David Blythe and Jack Doweck and Hong Jiang and Kao, \{Wen Fu\} and Julius Mandelblat and Lihu Rappoport and Efraim Rotem and Ahmad Yasin",

note = "Publisher Copyright: {\textcopyright} 2016 IEEE.; 28th IEEE Hot Chips Symposium, HCS 2016 ; Conference date: 21-08-2016 Through 23-08-2016",

year = "2017",

month = may,

day = "30",

doi = "10.1109/HOTCHIPS.2016.7936222",

language = "English",

series = "2016 IEEE Hot Chips 28 Symposium, HCS 2016",

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Anati, I, Blythe, D, Doweck, J, Jiang, H, Kao, WF, Mandelblat, J, Rappoport, L, Rotem, E & Yasin, A 2017, Inside 6th gen Intel^® Core™: New microarchitecture code named skylake. in 2016 IEEE Hot Chips 28 Symposium, HCS 2016., 7936222, 2016 IEEE Hot Chips 28 Symposium, HCS 2016, Institute of Electrical and Electronics Engineers Inc., 28th IEEE Hot Chips Symposium, HCS 2016, Cupertino, United States, 21/08/16. https://doi.org/10.1109/HOTCHIPS.2016.7936222

Inside 6th gen Intel^® Core™: New microarchitecture code named skylake. / Anati, Ittai; Blythe, David; Doweck, Jack et al.
2016 IEEE Hot Chips 28 Symposium, HCS 2016. Institute of Electrical and Electronics Engineers Inc., 2017. 7936222 (2016 IEEE Hot Chips 28 Symposium, HCS 2016).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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