Combined scanning probe microscopy and electron microscopy study of microstructure evolution in copper processed by equal channel angular pressing

We produced submicrocrystalline Cu using the equal channel angular pressing technique with four passes. The as-deformed samples exhibited a high yield strength > 400 MPa and a poor elongation before failure < 20%. The majority of the grain boundaries after equal channel angular pressing were of the low-angle type. A series of heat treatments in the temperature range 220 - 300 °C was performed and partly recrystallized microstructures with different fractions of recrystallized grains were obtained. The microstructures were analyzed by a combination of transmission electron microscopy, orientation image microscopy, light microscopy and scanning probe microscopy. The increase in ductility in partly recrystallized samples was accompanied by a decrease in the yield strength. It was suggested that to obtain a bulk nanocrystalline material which is both strong and ductile the majority of the grain boundaries should be of the high-angle type. It is shown that the scanning probe microscopy technique allows one to determine the microstructure of partly and fully recrystallized samples and to draw qualitative conclusions about the defects density and their distribution in the sample.